Electrochemical characterization of NiO electrodes deposited via a scalable powder microblasting technique

In this contribution a novel powder coating processing technique (microblasting) for the fabrication of nickel oxide (NiOx) coatings is reported. ~1.2 μm thick NiOx coatings are deposited at 20 mm2 s−1 by the bombardment of the NiOx powder onto a Ni sheet using an air jet at a speed of more than 180 m s−1. Microblast deposited NiOx coatings can be prepared at a high processing rate, do not need further thermal treatment. Therefore, this scalable method is time and energy efficient. The mechano-chemical bonding between the powder particles and substrate results in the formation of strongly adherent NiOx coatings. Microstructural analyses were carried out using SEM, the chemical composition and coatings orientation were determined by XPS and XRD, respectively. The electroactivity of the microblast deposited NiOx coatings was compared with that of NiOx coatings obtained by sintering NiOx nanoparticles previously sprayed onto Ni sheets. In the absence of a redox mediator in the electrolyte, the reduction current of microblast deposited NiOx coatings, when analyzed in anhydrous environment, was two times larger than that produced by higher porosity NiOx nanoparticles coatings of the same thickness obtained through spray coating followed by sintering. Under analogous experimental conditions thin layers of NiOx obtained by using the sol–gel method, ultrasonic spray- and electro-deposition show generally lower current density with respect to microblast samples of the same thickness. The electrochemical reduction of NiOx coatings is controlled by the bulk characteristics of the oxide and the relatively ordered structure of microblast NiOx coatings with respect to sintered NiOx nanoparticles here considered, is expected to increase the electron mobility and ionic charge diffusion lengths in the microblast samples. Finally, the increased level of adhesion of the microblast film on the metallic substrate affords a good electrical contact at the metal/metal oxide interface, and constitutes another reason in support of the choice of microblast as low-cost and scalable deposition method for oxide layers to be employed in electrochemical applications.