Intellectual Property Protection and Security in Additive Manufacturing

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Title: Intellectual Property Protection and Security in Additive Manufacturing
Authors: George, AbrahamNewell, AnthonyPapakostas, Nikolaos
Permanent link: http://hdl.handle.net/10197/12744
Date: Sep-2019
Online since: 2022-01-19T12:39:38Z
Abstract: Product data management along a product lifecycle is complicated due to a wide range of resources, stakeholders and technologies being involved. During the product development phase, complex information is exchanged among several engineering teams and legal entities. Product lifecycle management (PLM) systems streamline and control the product data shared with other engineering and manufacturing parties. In additive manufacturing (AM), however, as opposed to the conventional manufacturing (CM) data supply chain, the ease with which intellectual property (IP) can be compromised by theft or malicious attacks, creates a significant challenge. These attacks can lead to loss of revenue due to illegal counterfeiting, or even failure of mission-critical parts where design could be modified to a functionally impaired configuration. This paper outlines and reviews the current strategies and new approaches possible to secure IP in AM systems, comparing the advantages and disadvantages of these technologies.
Funding Details: Science Foundation Ireland
Type of material: Book Chapter
Publisher: IOS Press
Keywords: Manufacturing workflowBlockchain technologiesDesign for additive manufacturingAgent-based systems
DOI: 10.3233/ATDE190042
Language: en
Status of Item: Peer reviewed
Is part of: Jin, Y. and Price, M. (eds.). Volume 9: Advances in Manufacturing Technology XXXIII
Conference Details: 17th International Conference on Manufacturing Research (ICMR 2019), Belfast, United Kingdom, 10-12 September 2019
ISBN: 978-1-64368-008-8
This item is made available under a Creative Commons License: https://creativecommons.org/licenses/by-nc-nd/3.0/ie/
Appears in Collections:Mechanical & Materials Engineering Research Collection
I-Form Research Collection

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