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Intellectual Property Protection and Security in Additive Manufacturing

Author(s)
George, Abraham  
Newell, Anthony  
Papakostas, Nikolaos  
Uri
http://hdl.handle.net/10197/12744
Date Issued
2019-09
Date Available
2022-01-19T12:39:38Z
Abstract
Product data management along a product lifecycle is complicated due to a wide range of resources, stakeholders and technologies being involved. During the product development phase, complex information is exchanged among several engineering teams and legal entities. Product lifecycle management (PLM) systems streamline and control the product data shared with other engineering and manufacturing parties. In additive manufacturing (AM), however, as opposed to the conventional manufacturing (CM) data supply chain, the ease with which intellectual property (IP) can be compromised by theft or malicious attacks, creates a significant challenge. These attacks can lead to loss of revenue due to illegal counterfeiting, or even failure of mission-critical parts where design could be modified to a functionally impaired configuration. This paper outlines and reviews the current strategies and new approaches possible to secure IP in AM systems, comparing the advantages and disadvantages of these technologies.
Sponsorship
Science Foundation Ireland
Type of Material
Book Chapter
Publisher
IOS Press
Subjects

Manufacturing workflo...

Blockchain technologi...

Design for additive m...

Agent-based systems

DOI
10.3233/ATDE190042
Language
English
Status of Item
Peer reviewed
Journal
Jin, Y. and Price, M. (eds.). Volume 9: Advances in Manufacturing Technology XXXIII
Conference Details
17th International Conference on Manufacturing Research (ICMR 2019), Belfast, United Kingdom, 10-12 September 2019
ISBN
978-1-64368-008-8
This item is made available under a Creative Commons License
https://creativecommons.org/licenses/by-nc-nd/3.0/ie/
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Intellectual Property Protection and Security in Additive Manufacturing.pdf

Size

182.65 KB

Format

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Checksum (MD5)

bd53626222babefe685c20149b6e744e

Owning collection
I-Form Research Collection
Mapped collections
Mechanical & Materials Engineering Research Collection

Item descriptive metadata is released under a CC-0 (public domain) license: https://creativecommons.org/public-domain/cc0/.
All other content is subject to copyright.

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