High rate and high temperature fracture behaviour of polycrystalline diamond

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Title: High rate and high temperature fracture behaviour of polycrystalline diamond
Authors: Petrović, Marin
Ivankovic, Alojz
Murphy, Neal
Permanent link: http://hdl.handle.net/10197/4692
Date: Sep-2011
Abstract: Polycrystalline diamond (PCD) materials have a variety of applications, mainly as cutting tools for machining non-ferrous metals and non-metallic materials. A significant application of PCD is in oil and gas industry for rock drilling operations. Other important areas, such as mining, have yet to reach their full potential. These cutters/tools are subjected to high operating temperatures, impact loads and abrasive wear during these operations, which may lead to their sudden failure. An advantage of these materials is that their structure and composition can be engineered to return properties required for specific applications and operations. In this study, the mechanical and fracture properties of two grades of PCD have been determined at dynamic loading rates up to 5 m/s and elevated temperature up to 600°C in laboratory conditions using three point bending (TPB) and split-Hopkinson pressure bar apparatus (SHPB). The results show Young’s modulus to be completely rate insensitive, while fracture toughness changes significantly. Two dominant regions can be observed on the rate scale: one predominated by the conductivity of the material and the other predominated by the rate of fracture where binder degrades locally at the crack tip. This behaviour was related to the material microstructure, where similarities and differences in the fracture of two different grades of PCD are shown examining polished fractured specimens using scanning electron microscopy, revealing mechanisms of fracture over the range of loading rates.
Funding Details: Other funder
Type of material: Journal Article
Publisher: Trans Tech Publications
Copyright (published version): 2011 Trans Tech Publications
Keywords: Fracture toughness;Young’s modulus;Loading rate;Temperature;Microstructure;PCD
DOI: 10.4028/www.scientific.net/KEM.488-489.670
Language: en
Status of Item: Peer reviewed
Appears in Collections:Mechanical & Materials Engineering Research Collection

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