The Bond Gap Thickness Effect on the Fracture Toughness of Nano-Toughened Structural Epoxy Adhesives
|Title:||The Bond Gap Thickness Effect on the Fracture Toughness of Nano-Toughened Structural Epoxy Adhesives||Authors:||Cooper, V.
|Permanent link:||http://hdl.handle.net/10197/4763||Date:||19-Feb-2010||Abstract:||This work employs combined experimental and numerical studies to investigate the effect of bond gap thickness on the fracture behaviour of a nano-toughened epoxy adhesive produced by Henkel. Tapered-double cantilever-beam (TDCB) joints were subjected to a constant low loading rate. The mode I fracture behaviour of the joints was investigated as a function of bond gap thickness, which was varied from 0.25 to 2.5 mm. A detailed analysis of the fracture surfaces was carried out using scanning electron microscopy (SEM) and variations of the microstructural features with the bond gap thickness, and corresponding constraint, were revealed. The Rice and Tracey void growth model is used to relate the local plastic strain calculated by measuring the size of the voids on the fracture surfaces with the constraint calculated numerically for each bond gap thickness. It was shown that the difference in constraint imposed by different bond gap thicknesses is responsible for the observed dependency of GIC.||Type of material:||Conference Publication||Publisher:||Adhesion Society||Copyright (published version):||2010 the authors||Keywords:||Bond gap thickness; Nano-toughened structural epoxy adhesives||Language:||en||Status of Item:||Peer reviewed||Conference Details:||33rd Annual Meeting of the Adhesion Society, Daytona Beach, Florida, February 21-24, 2010||metadata.dc.date.available:||2013-10-16T08:17:33Z|
|Appears in Collections:||Mechanical & Materials Engineering Research Collection|
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