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The Bond Gap Thickness Effect on the Fracture Toughness of Nano-Toughened Structural Epoxy Adhesives
Author(s)
Date Issued
2010-02-19
Date Available
2013-10-16T08:17:33Z
Abstract
This work employs combined experimental and numerical
studies to investigate the effect of bond gap thickness on
the fracture behaviour of a nano-toughened epoxy adhesive
produced by Henkel. Tapered-double cantilever-beam
(TDCB) joints were subjected to a constant low loading
rate. The mode I fracture behaviour of the joints was investigated
as a function of bond gap thickness, which was
varied from 0.25 to 2.5 mm. A detailed analysis of the
fracture surfaces was carried out using scanning electron
microscopy (SEM) and variations of the microstructural
features with the bond gap thickness, and corresponding
constraint, were revealed. The Rice and Tracey void
growth model is used to relate the local plastic strain calculated
by measuring the size of the voids on the fracture
surfaces with the constraint calculated numerically for
each bond gap thickness. It was shown that the difference
in constraint imposed by different bond gap thicknesses is
responsible for the observed dependency of GIC.
Type of Material
Conference Publication
Publisher
Adhesion Society
Copyright (Published Version)
2010 the authors
Language
English
Status of Item
Peer reviewed
Conference Details
33rd Annual Meeting of the Adhesion Society, Daytona Beach, Florida, February 21-24, 2010
This item is made available under a Creative Commons License
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