Dual mode control of the rotational grinding process

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Title: Dual mode control of the rotational grinding process
Authors: Ahearne, Eamonn
Logan, D.
Byrne, Gerald
Permanent link: http://hdl.handle.net/10197/4840
Date: Jan-2012
Abstract: The rotational grinding process enables the production of substrates to meet the submicron planarity specifications required for micro-fabrication of semiconductor integrated circuits. Improvements in process capability, with respect to both form and finish, have been generally realised by the development of machine tools and systems based on a principle of precise and predictable “position” control. An alternative principle for optimisation is demonstrated here comprising a dual mode control system where a “finishing mode” is based on local normal force control. Test results show significant relative improvements in levels of surface roughness and a reduction in the normal spatial variation.
Type of material: Journal Article
Publisher: Elsevier
Journal: CIRP Annals - Manufacturing Technology
Volume: 61
Issue: 1
Start page: 303
End page: 306
Copyright (published version): 2012 Elsevier
Keywords: GrindingControlSilicon
DOI: 10.1016/j.cirp.2012.03.095
Language: en
Status of Item: Peer reviewed
Appears in Collections:Mechanical & Materials Engineering Research Collection

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