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Dual mode control of the rotational grinding process
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| CIRP Paper Final+ 3 3 12.pdf | 2.46 MB | Adobe PDF | Download |
| Title: | Dual mode control of the rotational grinding process | Authors: | Ahearne, Eamonn Logan, D. Byrne, Gerald |
Permanent link: | http://hdl.handle.net/10197/4840 | Date: | Jan-2012 | Abstract: | The rotational grinding process enables the production of substrates to meet the submicron planarity specifications required for micro-fabrication of semiconductor integrated circuits. Improvements in process capability, with respect to both form and finish, have been generally realised by the development of machine tools and systems based on a principle of precise and predictable “position” control. An alternative principle for optimisation is demonstrated here comprising a dual mode control system where a “finishing mode” is based on local normal force control. Test results show significant relative improvements in levels of surface roughness and a reduction in the normal spatial variation. | Type of material: | Journal Article | Publisher: | Elsevier | Copyright (published version): | 2012 Elsevier | Keywords: | Grinding;Control;Silicon | DOI: | 10.1016/j.cirp.2012.03.095 | Language: | en | Status of Item: | Peer reviewed |
| Appears in Collections: | Mechanical & Materials Engineering Research Collection |
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