Dual mode control of the rotational grinding process
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|Title:||Dual mode control of the rotational grinding process||Authors:||Ahearne, Eamonn
|Permanent link:||http://hdl.handle.net/10197/4840||Date:||Jan-2012||Abstract:||The rotational grinding process enables the production of substrates to meet the submicron planarity specifications required for micro-fabrication of semiconductor integrated circuits. Improvements in process capability, with respect to both form and finish, have been generally realised by the development of machine tools and systems based on a principle of precise and predictable “position” control. An alternative principle for optimisation is demonstrated here comprising a dual mode control system where a “finishing mode” is based on local normal force control. Test results show significant relative improvements in levels of surface roughness and a reduction in the normal spatial variation.||Type of material:||Journal Article||Publisher:||Elsevier||Journal:||CIRP Annals - Manufacturing Technology||Volume:||61||Issue:||1||Start page:||303||End page:||306||Copyright (published version):||2012 Elsevier||Keywords:||Grinding; Control; Silicon||DOI:||10.1016/j.cirp.2012.03.095||Language:||en||Status of Item:||Peer reviewed|
|Appears in Collections:||Mechanical & Materials Engineering Research Collection|
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